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COOLER MASTER THERMAL PAD COLLECTION

Regular price
RM 19.00
Sale price
RM 19.00
Regular price
RM 0.00
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Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulated properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple and versatile.

Specifications
PRODUCT NAME : Thermal Pad
PRODUCT NUMBER
- 0.5mm : TPX-NOPP-9005-R1
- 1.0mm : TPX-NOPP-9010-R1
- 2.0mm : TPX-NOPP-9020-R1
- 3.0mm : TPX-NOPP-9030-R1
DIMENSIONS (L X W X H) : 95 x 45 mm
THERMAL CONDUCTIVITY : 13.3 (W/m.K)
COLOR : Purple
DENSITY : 3.4 + 0.2 g/cc
HARDNESS : 30~60 Sc
BREAKDOWN VOLTAGE : 6KV (1mm)
WORKING TEMPERATURE : -40 ~ 200°C